SOMATECT KZ Series

SOMATECT KZ Series
image of SOMATECT KZ Series

SOMATECT KZ Series are heat curable resins for semiconductor sealing. Various resins for different applications such as glob-top resins, underfill resins and CSP reinforcing resins, etc. are available.


Features

  1. Easy-to-use one-part resins, and excellent in storage stability.
  2. Glob-top Resins
    Various grades are available suited for each application adjusting to flow property and substrates, etc.
  3. Underfill Resins
    Excellent in properties of capillary flow and moisture resistance.
  4. CSP Reinforcing Resins
    Excellent for low temperature cure (at 80°C) as well as in repairability (KZ-107-4).
    High reliability types used for automobile PCBs are also available.

Product Line-Up and Properties

  1. Glob-top Resins KZ-300 Series
    Glob-top Resins KZ-300 Series
  2. Underfill Materials KZ-200 Series
    Underfill Materials KZ-200 Series
  3. Underfill Materials for BGA/CSP
    Underfill Materials for BGA/CSP
Application Properties Product
Name
Curing
Conditions
Viscosity Tg
Temp.
Linear Expansion Coefficient Shelf Life (Month/°C)
Glob-top Medium Flow/
Storage Stability
KZ-310 100°C
/60min
+
150°C
/150min
77Pa·s 150°C 2.3 ×
10-5°C-1
6/0
Underfill Capillary Flow
Type/High
Adhesion
KZ-210 150°C
/60min
40Pa·s 135°C 3.9 ×
10-5°C-1
3/≤-20
BGA
Reinforcing
Low Temp Cure/
Moisture
Resistance
KZ-106 85°C
/60min
or
100°C
/30min
9Pa·s 90°C 4.5 ×
10-5°C-1
6/5-10
Low Temp
Cure/
Repairability
KZ-107 80°C
/45min
or
120°C
/5min
3Pa·s 55°C 6.0 ×
10-5°C-1

( All the figures are representative values. )

For Contact

High-Tech Materials Department
11-2, Ginza 4-Chome, Chuo-Ku, Tokyo 104-8109, Japan
FAX: +81-3-3542-2170